直流镀锌,direct current plating
1)direct current plating直流镀锌
2)continuous vertical galvanizing line(CVGL)垂直热镀锌
3)galvanize[英]["ɡ?lv?na?z][美]["g?lv?"na?z]电镀，镀锌，通电流
4)DC plating直流镀
1.The comparison between the influences of pulse electroplating and DC electroplating on tungsten coating shows that pulse electrodeposition can enlarge the range of current density and is superior toDC plating in the surface morphology,thickness,crystallization and deposition state,purity of the obtained tungsten coating while the composition of plating solution is the same.在耐热钢基体上用Na2WO4-ZnO-WO3体系熔盐镀钨,比较了脉冲镀与直流镀对钨镀层性能的影响。
5)DC brush直流刷镀
1.and compared the pulse brush -film with theDC brush -film, the results show that the property of the pulse brush -film is better than that ofDC brush -film.应用MSD—3O—S逆变电源及普通刷镀电源,研究了脉冲刷镀层的沉积速度、硬度、耐磨性、结合强度等方面的性能,并与直流刷镀层进行了比较,结果表明脉冲刷镀层性能优于直流刷镀层。
6)DC plating直流电镀
1.This article described the technical innovation and development of PCB industry, especially inDC plating and surface finish zone , which impetused the PCB industry development.文章概述了近几年来在PCB工业中生产技术的革新与进步情况,特别是直流电镀(镀层均匀性、填孔镀等)、表面涂(镀)覆(化学镀镍/钯浸金和直接浸金等)技术的革新与进步,推动了PCB工艺技术的发展。
2.Aiming at the technology demand of advanced copper interconnect,the properties of electrodeposited copper film and parameters such as resistivity,texture coefficient,grain size and surface roughness were investigated byDC plating and pulse plating respectively.实验结果表明,在相同电流密度条件下,脉冲电镀所得Cu镀层电阻率较低,表面粗糙度较小,表面晶粒尺寸和晶粒密度较大,而直流电镀所得镀层(111)晶面的择优程度优于脉冲。
英文短句/例句
1.The Structure and Properties of NiFe Film and Cu/NiFe Prepared by DC Electroplatiing直流电镀NiFe薄膜和Cu/NiFe丝的结构与性能
2.Iron-based matrix performaces and DC-electroplated diamond bit直流电镀铁基胎体性能及其金刚石钻头研究
3."For some uses, such as electroplating, direct current is essential. "在某些用途上(如电镀)直流电仍然是不可少的。
4.Micro-via Filling and Through Hole Plating in one Process in Vertical Line垂直电镀线盲孔和通孔同步电镀工艺
5.Direct Determination of Hexavalent Chromium in Trivalent Chromium Plating Bath电镀三价铬镀液中Cr~(6+)的直接测定
6.Effect of Cathode Current Density on Quality of Ni-W Alloy Coating阴极电流密度对电镀Ni-W合金镀层质量的影响
7.Properties investigation of NiCr-CN thin films deposited by DC magnetron reactive sputtering直流磁控反应溅镀NiCr-CN薄膜性能研究
8.an alternating [a direct] current dynamo交流 [直流] 发电机
9.Study of Vertical-Structured GaN-Based LED by Electroplating Copper Layer;GaN基垂直结构LED电镀铜衬底的研究
10.Integrated Linear Electroplating Production Line Automation Control System;直线电镀生产线综合自动化控制系统
11.The process does not require electrical current or anodes as in electroplating.但是在电镀过程中不需要电流或阳极。
12.Investigations of Nucleation Mechanism in Initial Period for Direct Electroless Nickel-boron Plating on Magnesium Alloy and Electrochemical Properties of Plating Solution镁合金直接化学镀Ni-B初期成核机理及镀液电化学性能研究
13.CORROSION ELECTROCHEMICAL BEHAVIOR OF Ni-B COATING ON MAGNESIUM ALLOY AZ91D PREPARED BY DIRECTLY ELECTROLESS PLATING镁合金直接化学镀Ni-B镀层的腐蚀电化学行为研究
14.The principle and construction of the AC arc.介绍了交流电弧离子镀的原理和结构。
15.Extraction of Cr～(6+) from Electroplate Wastewater in an Impinging Extractor;撞击流反应器萃取电镀废水中的Cr～（6+）
16.convert (alternating current)to direct current将（交流电）变成直流电;
17.DC ammeter with shunt带分流器的直流电流表
18.DC motor converter set交流-直流电动变流器组
相关短句/例句
continuous vertical galvanizing line(CVGL)垂直热镀锌
3)galvanize[英]["ɡ?lv?na?z][美]["g?lv?"na?z]电镀，镀锌，通电流
4)DC plating直流镀
1.The comparison between the influences of pulse electroplating and DC electroplating on tungsten coating shows that pulse electrodeposition can enlarge the range of current density and is superior toDC plating in the surface morphology,thickness,crystallization and deposition state,purity of the obtained tungsten coating while the composition of plating solution is the same.在耐热钢基体上用Na2WO4-ZnO-WO3体系熔盐镀钨,比较了脉冲镀与直流镀对钨镀层性能的影响。
5)DC brush直流刷镀
1.and compared the pulse brush -film with theDC brush -film, the results show that the property of the pulse brush -film is better than that ofDC brush -film.应用MSD—3O—S逆变电源及普通刷镀电源,研究了脉冲刷镀层的沉积速度、硬度、耐磨性、结合强度等方面的性能,并与直流刷镀层进行了比较,结果表明脉冲刷镀层性能优于直流刷镀层。
6)DC plating直流电镀
1.This article described the technical innovation and development of PCB industry, especially inDC plating and surface finish zone , which impetused the PCB industry development.文章概述了近几年来在PCB工业中生产技术的革新与进步情况,特别是直流电镀(镀层均匀性、填孔镀等)、表面涂(镀)覆(化学镀镍/钯浸金和直接浸金等)技术的革新与进步,推动了PCB工艺技术的发展。
2.Aiming at the technology demand of advanced copper interconnect,the properties of electrodeposited copper film and parameters such as resistivity,texture coefficient,grain size and surface roughness were investigated byDC plating and pulse plating respectively.实验结果表明,在相同电流密度条件下,脉冲电镀所得Cu镀层电阻率较低,表面粗糙度较小,表面晶粒尺寸和晶粒密度较大,而直流电镀所得镀层(111)晶面的择优程度优于脉冲。
延伸阅读
直流直流Direct current直流(direet。urrent) ，仅按一个方向流过电路或设备的电流称为直流。与交流电压相比，直流电压的极性是不变的。直流电流相当于电荷沿着闭合的电路以不变的方向流动或位移。直流电流和电压的幅值可以恒定，也可以随时间变化。蓄电池和旋转发电机产生幅值恒定的额定直流电压，整流器产生幅值随时间而变的直流电压。整流器把交流电压变换为脉动的直流电压。通常电站不是广泛地将直流电输配给一般用户，相反，在需要直流电(d。)能的场所，是把商业上合用的交流电(ac)能整流为直流电能。 「罗布(D.D.Robb)撰]
